Thermal interface material is used to fill the gaps between thermal transfer surfaces, such as between microprocessors and heat sinks, in order to increase thermal transfer efficiency. These gaps are normally filled with air which is a very poor conductor. The material is easy to handle and is not messy. It is available in solid and liquid form and in various thicknesses.
熱界面材料被用于在熱傳輸面之間填充裂隙，如在微處理器和散熱器之間，為了增加熱轉(zhuǎn)換效率。這些裂隙通常被填充空氣，這是個非常不良的導體。該材料是非常容易操作的，是不骯臟的。它是可用以固體和液體形式，以各種不同的厚度。
Thermal conductivity熱導率
The thermal conductivity of the interface material has a significant impact on its thermal performance. The high thermal conductivity guarantees sufficient heat transfer, resulting in a better cooling solution and the desired heat dissipation.
界面材料的熱導率在它的熱特性上有一個重要的影響。高的熱導率確保充分的熱傳輸，導致一個更好的冷卻解決和得到理想的熱耗散。
Properties特性
- Good insulation properties好的絕緣性能
- Heat-conducting熱傳導的
- Good compressibility好的壓縮率
- Flexible柔軟的
- Environmentally friendly利于環(huán)境保護的
Benefits好處
- Smooth surface平滑表面
- Very good thermal transfer properties even at very low contact pressure非常好的熱轉(zhuǎn)移特性，即使在非常低的接觸壓力。
- Low hardness低硬度
- High self-adhesion高的自粘作用
- UL listed列表
- Thickness 0.01 to 8 mm厚度
This film is especially suitable for high-power applications.這個薄片是非常適合于高功率的應用。
It has excellent thermal and electrical properties.它有卓越的熱和電特性。
Thanks to its good performance, the material can be used reliably in densely packed electronic applications.由于它的良好性能，該材料能被可靠地使用在密集的裝配電子應用方面。
Standard part numbers標準零件號
Part number零件號 | Thermal conductivity熱導率 | Thermal resistance熱阻 | Hardness硬度 | Characteristics特性 |
| W/mK | K/W | Shore 00 |
|
Tim-600 | 6.0 | 0.20 | 60-70 | highest thermal conductivity最高的熱導率 |
